型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4B1G1646I-BYK0 | IC |
SAMSUNG/三星 |
BGA |
20+ |
11200 |
|||
RC28F128P33B85B | IC |
NUMONYX |
BGA |
10+ |
10000 |
|||
HY57V561620FLTP-H-C | IC |
HUAYI/华羿微 |
TSOP |
08+ |
10500 |
|||
K4T1G164QJ-BCF7 | IC |
SAMSUNG/三星 |
BGA |
21+ |
11200 |
|||
MX30LF1G28AD-TI | IC |
MXIC/旺宏 |
TSOP48 |
2021+ |
2310 |
|||
S29GL032N90TFI040 | 存储IC |
SPANSION/飞索半导体 |
TSSOP |
22+ |
7540 |
|||
K4B4G1646E-BYMA | 存储IC |
SAMSUNG/三星 |
BGA |
22+ |
10000 |
|||
H5TC4G83EFR-RDA | 存储IC |
SKHYNIX/海力士 |
BGA |
2021+ |
6000 |
|||
S34ML01G200TFI000 | 存储IC |
SPANSION/飞索半导体 |
TSSOP |
21+ |
8960 |
|||
MT29C2G24MAAAAKAKD-5IT | 存储IC |
MICRON/美光 |
BGA |
2013+ |
8000 |
|||
W9864G6JH-6 | IC |
WINBOND/华邦 |
TSOP54 |
1320+ |
2592 |
|||
IS42S16100C1-7TL | IC |
ISSI/芯成 |
TSOP50 |
0604+ |
18270 |
|||
S29JL032H70TFI020 | 存储IC |
SAMSUNG/三星 |
TSSOP |
01528+ |
924 |
|||
S29GL01GS12FHIV1 | 存储IC |
SPANSION/飞索半导体 |
BGA |
1245+ |
1600 |
|||
S29GL01GP11FFAR2 | 存储IC |
SPANSION/飞索半导体 |
BGA |
11+ |
1596 |
|||
NT5TU64M16GG-3C | 存储IC |
NANYA/南亚 |
BGA |
12+ |
5670 |
|||
S29GL128N11FFIS3 | IC |
SPANSION/飞索半导体 |
BGA |
0703+ |
3380 |
|||
MT47H256M8THN-25E:H | 存储IC |
MICRON/美光 |
BGA |
1534+ |
8783 |
|||
H5TQ2G63GFR-RDC | 存储IC |
SKHYNIX/海力士 |
BGA |
19+ |
18000 |
|||
W29EE512-70 | 存储IC |
WINBOND/华邦 |
TSSOP |
0428 |
2000 |
商家默认展示20条库存